Nordic Semiconductor, a global leader in low-power wireless IoT connectivity solutions, is excited to announce the launch of its new Wafer-Level Chip Scale Package (WLCSP) version of the highly acclaimed nRF7002 Wi-Fi 6 Companion IC!
The nRF7002 WLCSP brings the same cutting-edge functionality as the existing QFN variant but with a remarkable footprint reduction of over 60%! This compact design makes it the perfect choice for developers focused on creating efficient, size-constrained devices for next-generation wireless applications.
This new package option is engineered to support the advanced capabilities of Wi-Fi 6, including:
- OFDMA (Orthogonal Frequency Division Multiple Access): Enabling multiple devices to communicate simultaneously, enhancing network efficiency and performance.
- Target Wake Time (TWT): Allowing devices to schedule when to wake up for data transmission, significantly improving battery life.
The nRF7002 WLCSP is specifically optimized for ultra-low power operation, ensuring that your connected devices enjoy extended battery life while maintaining robust wireless connectivity. This is crucial in applications where longevity and efficiency are paramount, such as in modules, wearables, and portable medical devices.
With its smaller form factor, the nRF7002 WLCSP provides a versatile Wi-Fi solution that fits seamlessly into space-critical designs. Developers can now create innovative products without compromising on functionality or performance.
Nordic Semiconductor continues to pave the way in IoT connectivity with the nRF7002 WLCSP, delivering a superior balance of size, power efficiency, and advanced features. Whether you're developing cutting-edge wearables or portable medical devices, this new IC empowers innovation without limits.
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